▌ Product introduction

BOYA Technology offers Known Good Die (KGD) products in addition to standard packaged NOR Flash memory devices. KGD memory is the preferred option for chipset vendors that wish to include non-volatile memory in System-in-Package (SIP) or Multi-Chip-Modules (MCM’s) to reduce device footprint, increase security and simplify system design. Our KGD memory products have the same superior quality and performance as our packaged parts, with all memory die pre-tested and verified. KGD offers a compact and reliable solution for modules used in mobile and IoT devices, enabling manufacturers to improve device performance, reduce the risk of failure and optimize space utilization.
 
All SPI NOR products are offered with a KGD option.
KGD products are delivered in wafer form without dicing.
Dedicated technical staff to work with KGD customers.
Please do not hesitate to contact us if you have any KGD related requirements.